Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson PDF

By James J. Licari,Dale W. Swanson

ISBN-10: 0128103701

ISBN-13: 9780128103708

ISBN-10: 1437778895

ISBN-13: 9781437778892

Adhesives are primary within the manufacture and meeting of digital circuits and items. typically, electronics layout engineers and production engineers aren't good versed in adhesives, whereas adhesion chemists have a constrained wisdom of electronics. This publication bridges those wisdom gaps and turns out to be useful to either teams.

The e-book comprises chapters masking forms of adhesive, the chemistry on which they're dependent, and their homes, functions, techniques, requisites, and reliability. assurance of toxicity, environmental affects and the regulatory framework make this publication fairly very important for engineers and bosses alike.

The 3rd version has been up to date all through and comprises new sections on nanomaterials, environmental affects and new environmentally pleasant ‘green’ adhesives. information regarding rules and compliance has been introduced totally up-to-date.

As good as offering complete assurance of ordinary adhesive varieties, Licari explores the newest advancements in fields such as:

• Tamper-proof adhesives for digital protection devices.

• Bio-compatible adhesives for implantable clinical devices.

• Electrically conductive adhesives to switch poisonous tin-lead solders in published circuit meeting – as required via regulatory regimes, e.g. the EU’s restrict of unsafe elements Directive or RoHS (compliance is needed for all items put on the eu market).

• Nano-fillers in adhesives, used to extend the thermal conductivity of present adhesives for cooling digital devices.

  • A whole consultant for the electronics to adhesive varieties, their houses and purposes – this publication is an important reference for a variety of experts together with electric engineers, adhesion chemists and different engineering professionals
  • Provides requirements of adhesives for specific makes use of and descriptions the approaches for software and curing – assurance that's of specific gain to layout engineers, who're charged with developing the interface among the adhesive fabric and the microelectronic device
  • Discusses the respective merits and barriers of other adhesives for a various functions, thereby addressing reliability concerns prior to they take place and supplying invaluable details to either layout engineers and caliber coverage personnel

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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